Transistors with reduced defect and methods forming same

ABSTRACT

A device includes a semiconductor region, an interfacial layer over the semiconductor region, the interfacial layer including a semiconductor oxide, a high-k dielectric layer over the interfacial layer, and an intermixing layer over the high-k dielectric layer. The intermixing layer includes oxygen, a metal in the high-k dielectric layer, and an additional metal. A work-function layer is over the intermixing layer. A filling-metal region is over the work-function layer.

BACKGROUND

Metal-Oxide-Semiconductor (MOS) devices are basic building elements inintegrated circuits. A MOS device may have a gate electrode formed ofpolysilicon doped with p-type or n-type impurities, which are dopedusing doping processes such as ion implantation or thermal diffusion.The work function of the gate electrode may be adjusted to the band-edgeof silicon. For an n-type Metal-Oxide-Semiconductor (NMOS) device, thework function may be adjusted to close to the conduction band ofsilicon. For a P-type Metal-Oxide-Semiconductor (PMOS) device, the workfunction may be adjusted to close to the valence band of silicon.Adjusting the work function of the polysilicon gate electrode can beachieved by selecting appropriate impurities.

MOS devices with polysilicon gate electrodes exhibit carrier depletioneffect, which is also known as a poly depletion effect. The polydepletion effect occurs when the applied electrical fields sweep awaycarriers from gate regions close to gate dielectrics, forming depletionlayers. In an n-doped polysilicon layer, the depletion layer includesionized non-mobile donor sites, wherein in a p-doped polysilicon layer,the depletion layer includes ionized non-mobile acceptor sites. Thedepletion effect results in an increase in the effective gate dielectricthickness, making it more difficult for an inversion layer to be createdat the surface of the semiconductor.

The poly depletion problem may be solved by forming metal gateelectrodes, wherein the metallic gates used in NMOS devices and PMOSdevices may also have band-edge work functions. Accordingly, theresulting metal gates include a plurality of layers to meet therequirements of the NMOS devices and PMOS devices.

The formation of metal gates typically involves depositing metal layersand then performing Chemical Mechanical Polish (CMP) processes to removeexcess portions of the metal layers. The remaining portions of the metallayers form metal gates.

BRIEF DESCRIPTION OF THE DRAWINGS

Aspects of the present disclosure are best understood from the followingdetailed description when read with the accompanying figures. It isnoted that, in accordance with the standard practice in the industry,various features are not drawn to scale. In fact, the dimensions of thevarious features may be arbitrarily increased or reduced for clarity ofdiscussion.

FIGS. 1-6, 7A, 7B, 8A, 8B, 9, 10A, 10B, 11-18, 23 and 24 illustrate theperspective views and cross-sectional views of intermediate stages inthe formation of a Fin Field-Effect Transistor (FinFET) in accordancewith some embodiments.

FIGS. 19 and 20 illustrate the cross-sectional views of some portions ofgate stacks of FinFETs in accordance with some embodiments.

FIGS. 21 and 22 illustrate the cross-sectional views of intermediatestages in the formation of a gate stack of a FinFET in accordance withsome embodiments.

FIGS. 25 through 30 illustrate the results of the sample FinFETs inaccordance with some embodiments.

FIGS. 31 and 32 illustrate the comparison of gate stacks of p-type andn-type transistors, respectively in accordance with some embodiments.

FIG. 33 illustrates a process flow for forming a gate stack inaccordance with some embodiments.

DETAILED DESCRIPTION

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present disclosure. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

Further, spatially relative terms, such as “underlying,” “below,”“lower,” “overlying,” “upper” and the like, may be used herein for easeof description to describe one element or feature's relationship toanother element(s) or feature(s) as illustrated in the figures. Thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. The apparatus may be otherwiseoriented (rotated 90 degrees or at other orientations) and the spatiallyrelative descriptors used herein may likewise be interpretedaccordingly.

Transistors with replacement gates and the methods of forming the sameare provided in accordance with various embodiments. The intermediatestages of forming the transistors are illustrated in accordance withsome embodiments. Some variations of some embodiments are discussed.Throughout the various views and illustrative embodiments, likereference numbers are used to designate like elements. In theillustrated example embodiments, the formation of Fin Field-EffectTransistors (FinFETs) is used as an example to explain the concept ofthe present disclosure. Other types of transistors such as planartransistors and Gate-All-Around (GAA) transistors may also adopt theconcept of the present disclosure. In accordance with some embodimentsof the present disclosure, a silicon germanium fin is formed. Aninterfacial layer (IL), which includes silicon oxide and germaniumoxide, is formed on the silicon germanium fin, followed by thedeposition of a high-k dielectric layer. A metal layer is formed overthe high-k dielectric layer. An anneal process is performed. The annealprocess results in the oxygen atoms in the IL to diffuse into, and bondwith, the metal in the metal layer. The germanium atoms in the IL, onthe other hand, diffuse down into the silicon germanium fin.Accordingly, the IL becomes silicon-rich due to the removal of thegermanium oxide. The IL also becomes thinner, and the Effective OxideThickness (EOT) of the gate dielectric is reduced. The underlyinggermanium-containing fin becomes germanium rich, which results in theincrease in the channel mobility.

FIGS. 1-6, 7A, 7B, 8A, 8B, 9, 10A, 10B, 11-18, 23 and 24 illustrate thecross-sectional views and perspective views of intermediate stages inthe formation of a Fin Field-Effect Transistor (FinFET) in accordancewith some embodiments of the present disclosure. The processes shown inthese figures are also reflected schematically in the process flow 200shown in FIG. 33.

In FIG. 1, substrate 20 is provided. The substrate 20 may be asemiconductor substrate, such as a bulk semiconductor substrate, aSemiconductor-On-Insulator (SOI) substrate, or the like, which may bedoped (e.g., with a p-type or an n-type dopant) or undoped. Thesemiconductor substrate 20 may be a part of wafer 10, such as a siliconwafer. Generally, an SOI substrate is a layer of a semiconductormaterial formed on an insulator layer. The insulator layer may be, forexample, a Buried Oxide (BOX) layer, a silicon oxide layer, or the like.The insulator layer is provided on a substrate, typically a silicon orglass substrate. Other substrates such as a multi-layered or gradientsubstrate may also be used. In some embodiments, the semiconductormaterial of semiconductor substrate 20 may include silicon; germanium; acompound semiconductor including silicon carbide, gallium arsenic,gallium phosphide, indium phosphide, indium arsenide, and/or indiumantimonide; an alloy semiconductor including SiGe, GaAsP, AlInAs,AlGaAs, GaInAs, GaInP, and/or GaInAsP; or combinations thereof.

Further referring to FIG. 1, well region 22 is formed in substrate 20.The respective process is illustrated as process 202 in the process flow200 shown in FIG. 33. In accordance with some embodiments of the presentdisclosure, well region 22 is an n-type well region formed throughimplanting an n-type impurity, which may be phosphorus, arsenic,antimony, or the like, into substrate 20. In accordance with otherembodiments of the present disclosure, well region 22 is a p-type wellregion formed through implanting a p-type impurity, which may be boron,indium, or the like, into substrate 20. The resulting well region 22 mayextend to the top surface of substrate 20. The n-type or p-type impurityconcentration may be equal to or less than 10¹⁸ cm⁻³, such as in therange between about 10¹⁷ cm⁻³ and about 10¹⁸ cm⁻³.

Referring to FIG. 2, isolation regions 24 are formed to extend from atop surface of substrate 20 into substrate 20. Isolation regions 24 arealternatively referred to as Shallow Trench Isolation (STI) regionshereinafter. The respective process is illustrated as process 204 in theprocess flow 200 shown in FIG. 33. The portions of substrate 20 betweenneighboring STI regions 24 are referred to as semiconductor strips 26.To form STI regions 24, pad oxide layer 28 and hard mask layer 30 areformed on semiconductor substrate 20, and are then patterned. Pad oxidelayer 28 may be a thin film formed of silicon oxide. In accordance withsome embodiments of the present disclosure, pad oxide layer 28 is formedin a thermal oxidation process, wherein a top surface layer ofsemiconductor substrate 20 is oxidized. Pad oxide layer 28 acts as anadhesion layer between semiconductor substrate 20 and hard mask layer30. Pad oxide layer 28 may also act as an etch stop layer for etchinghard mask layer 30. In accordance with some embodiments of the presentdisclosure, hard mask layer 30 is formed of silicon nitride, forexample, using Low-Pressure Chemical Vapor Deposition (LPCVD). Inaccordance with other embodiments of the present disclosure, hard masklayer 30 is formed by thermal nitridation of silicon, or Plasma EnhancedChemical Vapor Deposition (PECVD). A photo resist (not shown) is formedon hard mask layer 30 and is then patterned. Hard mask layer 30 is thenpatterned using the patterned photo resist as an etching mask to formhard masks 30 as shown in FIG. 2.

Next, the patterned hard mask layer 30 is used as an etching mask toetch pad oxide layer 28 and substrate 20, followed by filling theresulting trenches in substrate 20 with a dielectric material(s). Aplanarization process such as a Chemical Mechanical Polish (CMP) processor a mechanical grinding process is performed to remove excessingportions of the dielectric materials, and the remaining portions of thedielectric materials(s) are STI regions 24. STI regions 24 may include aliner dielectric (not shown), which may be a thermal oxide formedthrough a thermal oxidation of a surface layer of substrate 20. Theliner dielectric may also be a deposited silicon oxide layer, siliconnitride layer, or the like formed using, for example, Atomic LayerDeposition (ALD), High-Density Plasma Chemical Vapor Deposition(HDPCVD), or Chemical Vapor Deposition (CVD). STI regions 24 may alsoinclude a dielectric material over the liner dielectric, wherein thedielectric material may be formed using Flowable Chemical VaporDeposition (FCVD), spin-on coating, or the like. The dielectric materialover the liner dielectric may include silicon oxide in accordance withsome embodiments.

The top surfaces of hard masks 30 and the top surfaces of STI regions 24may be substantially level with each other. Semiconductor strips 26 arebetween neighboring STI regions 24. In accordance with some embodimentsof the present disclosure, semiconductor strips 26 are parts of theoriginal substrate 20, and hence the material of semiconductor strips 26is the same as that of substrate 20. In accordance with alternativeembodiments of the present disclosure, semiconductor strips 26 arereplacement strips formed by etching the portions of substrate 20between STI regions 24 to form recesses, and performing an epitaxy toregrow another semiconductor material in the recesses. Accordingly,semiconductor strips 26 are formed of a semiconductor material differentfrom the material of substrate 20. In accordance with some embodiments,semiconductor strips 26 are formed of a germanium-containing materialsuch as silicon germanium. The germanium atomic percentage in protrudingfins 36 may be in the range between about 30 percent and about 70percent in accordance with some embodiments.

Referring to FIG. 3, STI regions 24 are recessed, so that the topportions of semiconductor strips 26 protrude higher than the topsurfaces 24A of the remaining portions of STI regions 24 to formprotruding fins 36. The respective process is illustrated as process 206in the process flow 200 shown in FIG. 33. The etching may be performedusing a dry etching process, wherein HF₃ and NH₃, for example, are usedas the etching gases. During the etching process, plasma may begenerated. Argon may also be included. In accordance with alternativeembodiments of the present disclosure, the recessing of STI regions 24is performed using a wet etching process. The etching chemical mayinclude HF, for example.

In accordance with some embodiments of the present disclosure,protruding fins 36 are formed of the germanium-containing material suchas silicon germanium. In accordance with alternative embodiments,protruding fins 36 comprises silicon and is free from germanium. Thesemiconductor fins including germanium and the semiconductor fins freefrom germanium may be formed in a same wafer. For example, referring toFIG. 8B, in wafer 10, there may be an n-type FinFET region 21N and ap-type FinFET region 21P, in which an n-type FinFET and a p-type FinFET,respectively, are to be formed. The protruding fins 36A may be asilicon-containing fin (free from germanium), and the protruding fins36B may be a silicon germanium fin. In the following discussion, unlessspecified otherwise, the protruding fins refer to the protruding fins36B, which may be formed of silicon germanium.

In above-illustrated embodiments, the fins may be patterned by anysuitable method. For example, the fins may be patterned using one ormore photolithography processes, including double-patterning ormulti-patterning processes. Generally, double-patterning ormulti-patterning processes combine photolithography and self-alignedprocesses, allowing patterns to be created that have, for example,pitches smaller than what is otherwise obtainable using a single, directphotolithography process. For example, in one embodiment, a sacrificiallayer is formed over a substrate and patterned using a photolithographyprocess. Spacers are formed alongside the patterned sacrificial layerusing a self-aligned process. The sacrificial layer is then removed, andthe remaining spacers, or mandrels, may then be used to pattern thefins.

Referring to FIG. 4, dummy gate stacks 38 are formed to extend on thetop surfaces and the sidewalls of (protruding) fins 36. The respectiveprocess is illustrated as process 208 in the process flow 200 shown inFIG. 33. Dummy gate stacks 38 may include dummy gate dielectrics 40 anddummy gate electrodes 42 over dummy gate dielectrics 40. Dummy gateelectrodes 42 may be formed, for example, using polysilicon, and othermaterials may also be used. Each of dummy gate stacks 38 may alsoinclude one (or a plurality of) hard mask layer 44 over dummy gateelectrodes 42. Hard mask layers 44 may be formed of silicon nitride,silicon oxide, silicon carbo-nitride, or multi-layers thereof. Dummygate stacks 38 may cross over a single one or a plurality of protrudingfins 36 and/or STI regions 24. Dummy gate stacks 38 also have lengthwisedirections perpendicular to the lengthwise directions of protruding fins36.

Next, gate spacers 46 are formed on the sidewalls of dummy gate stacks38. The respective process is also shown as process 208 in the processflow 200 shown in FIG. 33. In accordance with some embodiments of thepresent disclosure, gate spacers 46 are formed of a dielectricmaterial(s) such as silicon nitride, silicon carbo-nitride, or the like,and may have a single-layer structure or a multi-layer structureincluding a plurality of dielectric layers.

An etching process is then performed to etch the portions of protrudingfins 36 that are not covered by dummy gate stacks 38 and gate spacers46, resulting in the structure shown in FIG. 5. The respective processis illustrated as process 210 in the process flow 200 shown in FIG. 33.The recessing may be anisotropic, and hence the portions of fins 36directly underlying dummy gate stacks 38 and gate spacers 46 areprotected, and are not etched. The top surfaces of the recessedsemiconductor strips 26 may be lower than the top surfaces 24A of STIregions 24 in accordance with some embodiments. Recesses 50 areaccordingly formed. Recesses 50 comprise portions located on theopposite sides of dummy gate stacks 38, and portions between remainingportions of protruding fins 36.

Next, epitaxy regions (source/drain regions) 54 are formed byselectively growing (through epitaxy) a semiconductor material inrecesses 50, resulting in the structure in FIG. 6. The respectiveprocess is illustrated as process 212 in the process flow 200 shown inFIG. 33. Depending on whether the resulting FinFET is a p-type FinFET oran n-type FinFET, a p-type or an n-type impurity may be in-situ dopedwith the proceeding of the epitaxy. For example, when the resultingFinFET is a p-type FinFET, silicon germanium boron (SiGeB), siliconboron (SiB), or the like may be grown. Conversely, when the resultingFinFET is an n-type FinFET, silicon phosphorous (SiP), silicon carbonphosphorous (SiCP), or the like may be grown. In accordance withalternative embodiments of the present disclosure, epitaxy regions 54comprise III-V compound semiconductors such as GaAs, InP, GaN, InGaAs,InAlAs, GaSb, AlSb, AlAs, AlP, GaP, combinations thereof, ormulti-layers thereof. After Recesses 50 are filled with epitaxy regions54, the further epitaxial growth of epitaxy regions 54 causes epitaxyregions 54 to expand horizontally, and facets may be formed. The furthergrowth of epitaxy regions 54 may also cause neighboring epitaxy regions54 to merge with each other. Voids (air gaps) 56 may be generated.

FIG. 7A illustrates a perspective view of the structure after theformation of Contact Etch Stop Layer (CESL) 58 and Inter-LayerDielectric (ILD) 60. The respective process is illustrated as process214 in the process flow 200 shown in FIG. 33. CESL 58 may be formed ofsilicon oxide, silicon nitride, silicon carbo-nitride, or the like, andmay be formed using CVD, ALD, or the like. ILD 60 may include adielectric material formed using, for example, FCVD, spin-on coating,CVD, or another deposition method. ILD 60 may be formed of anoxygen-containing dielectric material, which may be a silicon-oxidebased material such as silicon oxide, Phospho-Silicate Glass (PSG),Boro-Silicate Glass (BSG), Boron-Doped Phospho-Silicate Glass (BPSG), orthe like. A planarization process such as a CMP process or a mechanicalgrinding process may be performed to level the top surfaces of ILD 60,dummy gate stacks 38, and gate spacers 46 with each other.

FIG. 7B illustrates the reference cross-section 7B-7B in FIG. 7A, inwhich dummy gate stacks 38 are illustrated. Next, the dummy gate stacks38 including hard mask layers 44, dummy gate electrodes 42 and dummygate dielectrics 40 are removed in an etching process(es), formingtrenches 62 between gate spacers 46, as shown in FIG. 8A. The respectiveprocess is illustrated as process 216 in the process flow 200 shown inFIG. 33. The top surfaces and the sidewalls of protruding fins 36 areexposed to trenches 62, as shown in FIG. 8B. FIG. 8B illustrates across-sectional view obtained from the reference cross-section 8B-8B inFIG. 8A, with both of an N-type transistor region 21N and a p-typetransistor region 21P illustrated. Furthermore, as aforementioned, theprotruding fins 36 may include silicon-containing fins 36A (which may befree from germanium) in n-type FinFET region 21N, andgermanium-containing fins 36B (which may comprise silicon germanium) inp-type FinFET region 21P. In FIG. 7B and some subsequent figures, thelevels of the top surfaces 24A and bottom surfaces 24B of STI regions 24are illustrated.

FIG. 9 illustrates the formation of ILs 64A and 64B on protruding fins36A and 36B, respectively, through an oxidation process. The respectiveprocess is illustrated as process 218 in the process flow 200 shown inFIG. 33. In accordance with some embodiments, the oxidation processincludes a chemical oxidation process, which is performed by contactingwafer 10 in a chemical solution comprising the mixture of one or more ofozonated (O₃)) De-Ionized) (DI) water, hydrogen peroxide (H₂O₂) sulfuricacid (H₂SO₄), ammonium hydroxide (NH₄OH), and the like, or combinationsthereof. The oxidation process may be performed at a temperature rangingfrom room temperature (for example, about 21° C.) to about 80° C. Inaccordance with alternative embodiments, the oxidation process includesa thermal oxidation process, in which wafer 10 is annealed in anoxygen-comprising environment including oxygen (O₂), ozone (O₃), or thelike. IL 64A may include silicon oxide (SiO₂), and may be free fromgermanium oxide. IL 64B may include silicon oxide and germanium oxide(which are also referred to as silicon germanium oxide).

Next, as shown in FIGS. 10A and 10B, additional components are formed toresult in replacement gate stacks 72 filling in trenches 62 (FIG. 8A).FIG. 10B illustrates the reference cross-section 10B-10B in FIG. 10A.Replacement gate stacks 72 include gate dielectrics 67 and thecorresponding gate electrodes 70.

As shown in FIG. 10B, gate dielectric 67 includes IL 64 and high-kdielectric layer 66 formed over IL 64. The formation process of high-kdielectric layer 66 is illustrated as process 220 in the process flow200 shown in FIG. 33. High-k dielectric layer 66 includes a high-kdielectric material such as hafnium oxide, lanthanum oxide, aluminumoxide, zirconium oxide, or the like. The dielectric constant (k-value)of the high-k dielectric material is higher than 3.9, and may be higherthan about 7.0, and sometimes as high as 21.0 or higher. High-kdielectric layer 66 is formed as a conformal layer, and extends on thesidewalls of protruding fins 36 and the top surfaces and the sidewallsof gate spacers 46. In accordance with some embodiments of the presentdisclosure, high-k dielectric layer 66 is formed using ALD, CVD, PECVD,Molecular-Beam Deposition (MBD), or the like.

Further referring to FIGS. 10A and 10B, gate electrode 70 is formed ongate dielectric 67. Gate electrode 70 may include a plurality ofmetal-containing layers 74, which may be formed as conformal layers, anda filling-metal region 76 filling the rest of the trench unfilled by theplurality of metal-containing layers 74. Metal-containing layers 74 mayinclude a barrier layer, one or a plurality work-function layers overthe barrier layer, and one or a plurality of metal capping layers overthe work-function layer. The detailed structure of the metal-containinglayers 74 is discussed referring to FIGS. 11 through 18, which shows thegate structure for a p-type FinFET in accordance with some embodiments.

FIG. 10B schematically illustrates region 78, in which a portion of fin36, a portion of IL 64B, a portion of high-k dielectric layer 66, aportion of metal-containing layers 74, and a portion of filling-metalregion 76 are included. FIGS. 11 through 18 illustrate the formation ofthe features that extend into region 78 in accordance with someembodiments. It is appreciated that the high-k dielectric layer 66, andmetal-containing layers 74, and filling-metal region 76 may includehorizontal portions on the top of ILD 60 and gate spacers 46, whichhorizontal portions are removed in a planarization process to result inthe structure shown in FIG. 10B.

Referring to FIG. 11, IL 64B (also refer to FIG. 9) is on protruding fin36. High-k dielectric layer 66 is over and contacting IL 64B. Inaccordance some embodiments, Titanium Silicon Nitride (TSN) 120 isformed over high-k dielectric layer 66. The respective process isillustrated as process 222 in the process flow 200 shown in FIG. 33. TSNlayer 120 may be formed using ALD or CVD, and the TSN layer 120 mayinclude alternatingly deposited TiN layers and SiN layers. Since the TiNlayers and SiN layers are very thin, these layers may not be able to bedistinguished from each other, and hence in combination form a TSNlayer.

A Post-Metallization Anneal (PMA) process 122 is performed. Therespective process is also illustrated as process 222 in the processflow 200 shown in FIG. 33. The PMA process 122 may be performed usingfurnace anneal, flash anneal, or the like. The temperature of PMAprocess 122 may be in a range between about 600° C. and about 900° C.The annealing duration may be in the range between about 2 seconds andabout 120 seconds. The PMA process 122 may be performed with a processgas comprising NH₃, N₂, H₂, O₂, and/or the like.

FIG. 12 illustrates the deposition of silicon capping layer 124. Therespective process is illustrated as process 224 in the process flow 200shown in FIG. 33. In accordance with some embodiments, silicon cappinglayer 124 is deposited using a silicon-containing precursor comprisingsilane, disilane, dichlorosilane (DCS), or the like. After thedeposition, a Post-Capping Annealing (PCA) process 126 is performed. Therespective process is also illustrated as process 224 in the processflow 200 shown in FIG. 33. The PCA process may be performed usingfurnace anneal, flash anneal, or the like. The temperature of PCAprocess 126 may be in a range between about 650° C. and about 1,100° C.The annealing duration may be in the range between about 2 seconds andabout 120 seconds. The PCA process 126 may be performed with a processgas comprising NH₃, N₂, H₂, O₂, and/or the like.

Next, TSN layer 120 and silicon capping layer 124 are removed in anetching process(es). The respective process is illustrated as process226 in the process flow 200 shown in FIG. 33. The resulting structure isshown in FIG. 13. The deposition, annealing, and the subsequent removalof TSN layer 120 and silicon capping layer 124 may improve thereliability of high-k dielectric layer 66 and its thermal stability. Inaccordance with alternative embodiments of the present disclosure, thedeposition, annealing, and the subsequent removal of TSN layer 120 andsilicon capping layer 124 are skipped.

FIG. 14 illustrates the deposition of blocking layer 128 and metal layer130. The respective process is illustrated as processes 228 and 230 inthe process flow 200 shown in FIG. 33. In accordance with someembodiments, blocking layer 128 comprises or is a TiN layer, a TaNlayer, or composite layers thereof. The deposition process may includeCVD, ALD, and the like. The metal in metal layer 130 is selected to beable to penetrate through blocking layer 128 when annealed, and able toform an intermixing layer having desirable properties, as discussed insubsequent paragraphs. The metal in metal layer 130 is selected to beable to scavenge the Oxygen from Interfacial layer without creatingextra vacancies in high k dielectric layer, such that the selected metallayer 130's oxide have more stability than the SiOx and GeOx and lessstability than the high-k oxide. In accordance with some embodiments,metal layer 130 includes Al, Ti, Hf, Zr, Ta, Cr, W, V, Mo or alloysthereof. The deposition method may include Physical Vapor Deposition(PVD), or Atomic layer deposition (ALD) or Plasma enhanced Atomic layerdeposition (PEALD) or Chemical vapor deposition (CVD) for example.

The thickness T1 of blocking layer 128 is selected so that in asubsequent annealing process as shown in FIG. 15, it may function toblock excessive diffusion of the metal in metal layer 130 into high-kdielectric layer 66, while at the same time allowing enough amount ofmetal in metal layer 130 to reach the interface between blocking layer128 and high-k dielectric layer 66 to form an intermixing layer.Blocking layer 128 also allows oxygen atoms in IL 64B and IL 64A topenetrate through upwardly to reach metal layer 130. In accordance withsome embodiments, thickness T1 is in the range between about 5 Å andabout 40 Å. If thickness T1 is too big such as greater than about 40 Å,oxygen atoms cannot diffuse upwardly through blocking layer 128, and thepurpose of the subsequently performed annealing process is defeated. Ifthickness T1 is too small such as smaller than about 5 Å, excessivemetal atoms in metal layer 130 will diffuse downwardly, penetratethrough blocking layer 128, and diffuse into high-k dielectric layer 66.The diffused metal atoms in high-k dielectric layer 66 will thusadversely affect the property of high-k dielectric layer 66. ThicknessT2 of metal layer 130 may be in the range between about 5 Å and about150 Å.

FIG. 15 illustrates a Post-Deposition-Anneal (PDA) process 132. Therespective process is illustrated as process 232 in the process flow 200shown in FIG. 33. The PDA process may be performed using furnace anneal,flash anneal, or the like. The temperature and the annealing durationare controlled, so that desirable effect is achieved, as discussed insubsequent paragraphs, while no adverse effect is resulted. For example,if the temperature is too high and/or the anneal duration is too long,the metal in metal layer 130 may diffuse into the entire high-kdielectric layer 66, degrading its property and also High-k film maycrystallize. If the temperature is too low or the anneal duration is tooshort, the desirable effect is not achieved. Accordingly, the PDAprocess 132 may be performed at a temperature in a range between about400° C. and about 535° C. The annealing duration may be in the rangebetween about 15 seconds and about 45 seconds. The PDA process 132 maybe performed with a process gas comprising N₂, H₂, Ar, He, and/or thelike.

In the PDA process 132, the germanium oxide in IL 64B is decomposed inthe PMOS device region 21P and the silicon oxide in IL 64A is decomposedin NMOS device region 21N. The silicon oxide in IL 64B is more stablethan germanium oxide, and is not decomposed. This preferentialdecomposition of germanium oxide in IL 64B causes the decrease in theratio of the germanium atomic percentage to the silicon atomicpercentage in the IL 64B. The oxygen atoms in the decomposed germaniumoxide diffuse upwardly into metal layer 130, and forms metal oxide layer136 with a bottom portion (or an entirety) of metal layer 130. Forexample, depending on whether metal layer 130 comprises Al, Ti, Hf, Ta,Cr, W, V, Mo or Zr, metal oxide layer 136 may comprise aluminum oxide,titanium oxide, hafnium oxide, or zirconium oxide, respectively.

In the PDA process 132, the germanium atoms in the decomposed germaniumoxide diffuses downwardly into a top surface portion of protruding fin36, and forms germanium-rich layer 36-S, which forms at least a portionof the channel region of the respective transistor. Due to the extragermanium atoms added into the top surface portion of protruding fin 36,the germanium atomic percentage in germanium-rich layer 36-S is higherthan the germanium atomic percentage in the original top surface portionof protruding fin 36 by ΔC, and higher than the germanium atomicpercentage in the lower portion of protruding fins 36 also by ΔC. Theatomic percentage difference AC may be in the range between about 1percent and about 4 percent. Thickness T3 of germanium-rich layer 36-Smay be in the range between about 0.5 nm and about 1 nm.

Due to the decomposition of the germanium oxide and the out-diffusion ofgermanium atoms and oxygen atoms, the thickness of IL 64B is reduced inPMOS device region 21P. In addition, due to the decomposition of thesilicon oxide and the out-diffusion of oxygen atoms, the thickness of IL64A is reduced in NMOS device region 21N. For example, before thedeposition of metal layer 130, the thickness T4 of IL 64B or IL 64A(FIG. 13) is T4. After the PDA process 132, the thickness of one of IL64B and IL 64A, or both, is reduced to T4′ (FIG. 15), which is in therange between about 25%*T4 and about 80%*T4. For example, T4 may be inthe range between about 10 Å and about 120 Å, and thickness T4′ may bein the range between about 2 Å and about 80 Å. The EOT of the resultinggate dielectric is thus reduced.

In the PDA process 132, intermixing layer 134 is also formed at theboundary regions of high-k dielectric layer 66 and blocking layer 128.The intermixing layer 134 includes the metal (such as Hf) from high-kdielectric layer 66, the oxygen diffused from IL 64B, the metal diffusedfrom metal layer 130, and the metal (such as Ti) from blocking layer128. The metal from metal layer 130 may be the same or different fromthe metal(s) in high-k dielectric layer 66, and may be the same ordifferent from the metal(s) in layers 142A, 142B, 144, 146, and 148(FIG. 18). In accordance with some embodiments, intermixing layer 134includes Mx-Ti—Hf—O, wherein Mx is the metal in metal layer 130.Intermixing layer 134 is a dielectric layer, and may be Ti-rich,Zr-rich, Al-rich, or Hf-rich, depending on the metal in metal layer 130.Intermixing layer 134 has some advantageous features. For example, theTi-rich and Zr-rich intermixing layer 134 has a dielectric constantk_(IM) higher than the dielectric constant k_(HK) of high-k dielectriclayer 66, for example, with the k-value difference (k_(IM)−k_(HK)) beinggreater than about 1, and may be in the range between about 1 and 8.Intermixing layer 134 has the function of blocking the overlying workfunction metal layers (formed subsequently) from diffusing into high-kdielectric layer 66, thereby improving the high-k film quality, leakage,and the reliability of the respective device. Also, the Al-richintermixing layer 134 helps to boost p-type dipole, and may reduce thethreshold voltage of the p-type transistors. The Zr-rich intermixinglayer 134 may stabilize tetragonal phase in the high-k dielectric layer66, and may improve the thermal stability of high-k dielectric layer 66.

FIG. 25 illustrates a composition profile of some elements in variouslayers as shown in FIG. 15 in accordance with some embodiments. Thecomposition profile is measured from a sample wafer having the structurein FIG. 15 formed thereon. The example elements in the illustratedlayers are marked for easier understanding. For example, the samplestructure has the metal layer 130 formed of Hf, and the blocking layer128 formed of TiN. In FIG. 25, lines 338, 340, 342 and 344 represent theatomic percentages of Ge, Si, O, Hf, N, Ti, and Al, respectively. The Geatomic percentage (line 338) in germanium-rich SiGe layer 36-S is higherthan in SiGe protruding fin 36, hence the name germanium-rich.Correspondingly, the Si atomic percentage (line 340) in germanium-richSiGe layer 36-S is lower than in SiGe protruding fin 36.

FIG. 25 further illustrates that the IL layer 64B has significantlylower germanium-to-silicon ratio than in both of Ge-rich SiGe layer 36-Sand protruding fin 36, clearly indicating that germanium atoms havediffused out to Ge-rich SiGe layer 36-S. Intermixing layer 134 is alsoclearly shown, which has high atomic percentages of Hf, O, Ti, and Al.

FIG. 26 illustrates the atomic percentages of some elements inintermixing layer 134, high-k dielectric layer 66 and IL 64B, andprotruding fin 36 (including Ge-rich SiGe layer 36-S), wherein theX-axis represents the depth measured from the top surface of wafer 10,and the Y-axis represents the atomic percentages. The elements aremarked. Also, the intermixing layer 134 can also be observed clearly.

Next, the blocking layer 128, metal oxide layer 136, and metal layer 130as shown in FIG. 15 are etched, and the resulting structure is shown inFIG. 16. The respective process is illustrated as process 234 in theprocess flow 200 shown in FIG. 33. The etching chemical may be selecteddepending upon the materials of metal layer 130 and blocking layer 128,and may be selected from NH₄OH, HCl, HF, H₃PO₄, H₂O₂, H₂O, andcombinations thereof. For example, when metal layer 130 comprises Al,Ti, Hf, and/or Zr and when blocking layer 128 comprises TiN, the etchingchemical may include one or both of NH₄OH and HCl, and further includesH₂O₂ and H₂O. When metal layer 130 comprises Al, Ti, Hf, Ta, Cr, W, V,Mo and/or Zr and when blocking layer 128 comprises TaN, the etchingchemical may include the mixture of HF, NH₄OH, H₂O₂, and H₂O. After theetching, intermixing layer 134 is revealed.

FIG. 17 illustrates the deposition of barrier layer 142A in accordancewith some embodiments. The respective process is illustrated as process236 in the process flow 200 shown in FIG. 33. Barrier layer 142A is alsosometimes referred to as an adhesion layer, which may be formed of TiN,TaN, or the like.

After barrier layer 142A is formed, there may be (or may not be) anotherbarrier layer 142B deposited on barrier layer 142A. In accordance withother embodiments, neither of layers 142A and 142B is formed, and thesubsequently formed work-function layer 144 is in contact withintermixing layer 134.

Next, as also shown in FIG. 18, work-function layer 144 is formed overbarrier layer 142B (if formed). The respective process is illustrated asprocess 238 in the process flow 200 shown in FIG. 33. Work-functionlayer 144 determines the work function of the gate, and includes atleast one layer, or a plurality of layers formed of different materials.In accordance with some embodiments, work-function layer 144 may includea TaN layer, a TiN layer over the TaN layer, and a TiAl layer over theTiN layer. It is appreciated that the work-function layers may includedifferent materials, which are also contemplated.

In accordance with some embodiments of the present disclosure, a metalcapping layer 146 is formed over work-function layer 144, as shown inFIG. 18. The respective process is illustrated as process 240 in theprocess flow 200 shown in FIG. 33. Metal capping layer 146 may be formedof a metal nitride such as TiN in accordance with some embodiments, andother materials such as TaN may be used. Layers 142A, 142B, 144, and 146collectively correspond to stacked layers 74 in FIG. 10B.

FIG. 18 illustrates the formation of filling-metal region 148, whichcorresponds to filling-metal region 76 in FIG. 10B. The respectiveprocess is illustrated as process 242 in the process flow 200 shown inFIG. 33. The stack including intermixing layer 134 and the overlyinglayers corresponding to the stacked layers 74 in FIG. 10B. In accordancewith some embodiments, filling-metal region 148 is formed of tungsten orcobalt, which may be formed using ALD, CVD, or the like. After theformation of filling-metal region 148, a planarization process may beperformed to remove excess portions of the deposited layers as shown inFIG. 18, resulting in the gate stacks 72 as shown in FIGS. 10A and 10B.

As aforementioned, diffusion barriers 142A and 142B may or may not beformed. When diffusion barriers 142A and 142B are not formed, theresulting gate stack 72 is as shown in FIG. 19, in which work-functionlayer 144 is over and in physical contact with intermixing layer 134. Inaccordance with other embodiments, diffusion barrier 142B may be formed,while diffusion barrier 142A is not formed. The corresponding gate stack72 is shown in FIG. 20, in which work-function layer 144 is over and inphysical contact with diffusion barrier 142B.

FIGS. 21 and 22 illustrate the intermediate stages in the formation ofgate stack 72 in accordance with alternative embodiments. Unlessspecified otherwise, the materials and the formation processes of thecomponents in these embodiments are essentially the same as the likecomponents, which are denoted by like reference numerals in thepreceding embodiments shown in FIGS. 1 through 18. The details regardingthe formation process and the materials of the components shown in FIGS.21 and 22 may thus be found in the discussion of the precedingembodiments.

The initial steps of these embodiments are essentially the same as shownin FIGS. 1-6, 7A, 7B, 8A, 8B, 9, 10A, 10B, and 11-15. In a subsequentprocess, metal layer 130 and metal oxide layer 136 as shown in FIG. 15are removed in an etching process, while blocking layer 128 is notetched, as shown in FIG. 21. The corresponding etching process is thusreferred to as a partial etching process. In accordance with someembodiments, when metal layer 130 comprises Al, Ti, Hf, Ta, Cr, W, V, Moand/or Zr and when blocking layer 128 comprises TiN, the partial etchingchemical may include the mixture of HF, NH₄OH, H₂O₂, and H₂O. When metallayer 130 comprises Al, Ti, Hf, Ta, Cr, W, V, Mo and/or Zr and whenblocking layer 128 comprises TaN, the etching chemical may be selectedfrom the mixture of H₂O₂, H₃PO₄, and H₂O, the mixture of NH₄OH, H₂O₂,and H₂O, the mixture of HCl, H₂O₂, and H₂O, or the mixture of NH₄OH,HCl, H₂O₂, and H₂O. After the partial etching process, blocking layer128 is left, as shown in FIG. 21. Blocking layer 128 is formed ofsimilar material as, and has the same function as, diffusion barrierlayer 142A as shown in FIG. 18. FIG. 22 illustrates the overlyingdiffusion barrier layer 142B, work-function layer 144, capping layer146, and filling metal 148. Similarly, diffusion barrier layer 142B mayor may not be formed.

FIG. 23 illustrates the formation of hard masks 80 in accordance withsome embodiments. The formation of hard masks 80 may include performingan etching process to recess gate stacks 72, so that recesses are formedbetween gate spacers 46, filling the recesses with a dielectricmaterial, and then performing a planarization process such as a CMPprocess or a mechanical grinding process to remove excess portions ofthe dielectric material. Hard masks 80 may be formed of silicon nitride,silicon oxynitride, silicon oxy-carbo-nitride, or the like.

FIG. 24 illustrates the formation of source/drain contact plugs 82. Theformation of source/drain contact plugs 82 include etching ILD 60 toexpose the underlying portions of CESL 58, and then etching the exposedportions of CESL 58 to reveal source/drain regions 54. In a subsequentprocess, a metal layer (such as a Ti layer) is deposited and extendinginto the contact openings. A metal nitride capping layer may be formed.An anneal process is then performed to react the metal layer with thetop portion of source/drain regions 54 to form silicide regions 84, asshown in FIG. 24. Next, either the previously formed metal nitride layeris left without being removed, or the previously formed metal nitridelayer is removed, followed by the deposition of a new metal nitridelayer (such as a titanium nitride layer). A filling-metallic materialsuch as tungsten, cobalt, or the like, is then filled into the contactopenings, followed by a planarization to remove excess materials,resulting in source/drain contact plugs 82. Gate contact plugs (notshown) are also formed to penetrate through a portion of each of hardmasks 80 to contact gate electrodes 70. FinFETs 86, which may beconnected in parallel as one FinFET, is thus formed.

FIG. 27 illustrates the binding energies of silicon in PMOS deviceregion 21P. The peaks close to the binding energy of 102.8 eV representthe Si—O bonds, which correspond to the IL 64B. The peaks close to thebinding energy of 100 eV represent the Si—Si bonds and/or Si—Ge bonds,which correspond to the channel regions. Signal intensity line 152 isobtained from a first sample formed using conventional methods, in whichmetal layer 130 (FIG. 15) is not formed, and the anneal process 132(FIG. 15) is not performed. Signal intensity line 154 is obtained from asecond sample formed in accordance with some embodiments of the presentdisclosure, in which the metal layer 130 (FIG. 15) is formed, and theanneal process 132 (FIG. 15) is performed. The experiment results revealthat at the peak close to the binding energy of 102.8 eV (FIG. 27), thesignal intensity of line 154 is higher than the signal intensity of line152, indicating that in the IL of the second sample, silicon atomicpercentage is increased over that in the first sample, which also meansgermanium atomic percentage is reduced in the IL 64B due to thegermanium diffusion. At the peak close to the binding energy of 100 eV(FIG. 27), the signal intensity of line 154 is lower than the signalintensity of line 152, indicating that in the Ge-rich SiGe layer 36-S,silicon atomic percentage is reduced in the second sample than in thefirst sample, which also means germanium atomic percentage is increasedin the channel.

FIGS. 28 and 29 illustrate the binding energies of germanium. The signalintensity close to the binding energy of 33.5 eV in FIG. 28 and 1,222 eVin FIG. 29 represents the Ge—O bonds, which correspond to the IL 64B.The peaks close to the binding energy of 30 eV in FIG. 28 and 1,218 eVin FIG. 29 represent the Ge—Si bonds and Ge—Ge bonds, respectively,which corresponds to the channel regions. Signal intensity line 156 isobtained from the first sample formed using conventional methods. Signalintensity line 158 is obtained from the second sample formed inaccordance with some embodiments of the present disclosure. Theexperiment results reveal that close to the binding energy of 33.5 eV(FIG. 28) and 1,222 eV (FIG. 29), the signal intensity of the line 158is lower than the signal intensity of the signal intensity line 156,indicating that in the IL of the second sample, germanium atomicpercentage is reduced, indicating less Ge—O bonds in IL 64B due to thescavenging of oxygen from germanium oxide in IL into the metal layer 130and the out-diffusion of germanium into channel. At the peak close tothe binding energies of 30 eV (FIG. 28) and 1,218 eV (FIG. 29), thesignal intensity of line 158 is higher than the signal intensity of line156, indicating that in the Ge-rich SiGe layer 36-S, the germaniumatomic percentage is increased.

FIG. 30 illustrates the binding energies of silicon in NMOS deviceregion 21N. The peaks close to the binding energy of 102.8 eV representthe Si—O bonds, which correspond to the IL 64A. The peaks close to thebinding energy of 100 eV represent the Si—Si bonds, which correspond tothe Si channel regions. Signal intensity line 160 is obtained from thefirst sample formed using conventional methods, in which metal layer 130(FIG. 15) is not formed, and the anneal process 132 (FIG. 15) is notperformed. Signal intensity line 162 is obtained from the second sampleformed in accordance with some embodiments of the present disclosure, inwhich the metal layer 130 (FIG. 15) is formed, and the anneal process132 (FIG. 15) is performed. The experiment results reveal that at thepeak close to the binding energy of 102.8 eV (FIG. 30), the signalintensity of line 162 is lower than the signal intensity of line 160,indicating that in the IL 64A of the second sample, silicon atomicpercentage is decreased over that in the first sample, which also meansIL64A thickness is reduced.

FIG. 31 illustrates the comparison of the stacking scheme of alow-voltage p-type transistor, a standard-voltage p-type transistor, anda high-voltage p-type transistor in accordance with some embodiments.These devices differ from each other in that whether they includediffusion barrier layers 142A (or 128) and 142B. The formation of thesetransistors may share common processes for forming IL 64, high-kdielectric layer 66, intermixing layer 134, and work function layer 144.To form diffusion barrier layers 142A and 142B differently for differenttransistors, a first diffusion barrier layer 142A may be formed in allthree transistor regions, and then removed from both of the low-voltageand standard-voltage transistor regions. Next, a second diffusionbarrier layer 142B may be formed in all three transistor regions, andthen removed from the low-voltage transistor region. The thin IL layer64B includes silicon-rich and germanium-deficit oxide, and thework-function layers 144 include P-type work function metals.Furthermore, Ge-rich SiGe layers 36-S are formed in all three transistorregions.

FIG. 32 illustrates the comparison of the stacking scheme of alow-voltage n-type transistor, a standard-voltage n-type transistor, anda high-voltage n-type transistor in accordance with some embodiments.These devices differ from each other in that whether they includediffusion barrier layers 142A (or 128) and 142B. The corresponding ILsinclude a thin silicon oxide 64A, and the work-function layers includen-type work function metals. No Ge-rich layer is formed in the channelsof all three transistor regions.

The embodiments of the present disclosure have some advantageousfeatures. By forming a metal layer and annealing the metal layer duringthe formation of a gate of an n-type transistor, oxygen may be deprivedfrom the IL, which includes silicon oxide. By forming a metal layer andannealing the metal layer during the formation of a gate of a p-typetransistor, oxygen may be deprived from the IL, which includes siliconoxide and germanium oxide. Germanium is also diffused into theunderlying channel. Accordingly, the amount of germanium oxide in the ILis reduced. Germanium oxide is less stable than silicon oxide, and tendsto combine with oxygen to form germanium monoxide, with is gaseous andmay evaporate to leave vacancies in the IL. Furthermore the oxygenvacancy formation energy is lower in germanium oxide than that comparedto silicon oxide or high-k oxide. Thus, germanium oxide in ILcontributes to too much defects. Accordingly, the reduction of germaniumoxide results in the reduction of defects in the IL and reduction ofdensity of interface traps in p-type transistor. IL is also gets thinnerin both n-type transistor and in p-type transistor, and the EOT of thegate dielectric is reduced. The germanium diffused into the channelregions results in the desirable increase in the channel mobility forthe p-type transistors. Also, an intermixing layer is formed, which hasa high k value and other advantageous features.

In accordance with some embodiments of the present disclosure, a devicecomprises a semiconductor region; an interfacial layer over thesemiconductor region, the interfacial layer comprising a semiconductoroxide; a high-k dielectric layer over the interfacial layer; anintermixing layer over the high-k dielectric layer, wherein theintermixing layer comprises oxygen, a metal in the high-k dielectriclayer, and an additional metal; a work-function layer over theintermixing layer; and a filling-metal region over the work-functionlayer. In an embodiment, the additional metal is selected from the groupconsisting of aluminum, titanium, hafnium, zirconium, chromium,tantalum, tungsten, vanadium, molybdenum, and combinations thereof. Inan embodiment, the semiconductor region comprises: a lower portioncomprising silicon germanium having a first germanium atomic percentage;and an upper portion over and contacting the lower portion, wherein theupper portion comprises silicon germanium having a second germaniumatomic percentage greater than the first germanium atomic percentage. Inan embodiment, the upper portion has a thickness in a range betweenabout 0.5 nm and about 1 nm. In an embodiment, the second germaniumatomic percentage is greater than the first germanium atomic percentageby a difference, and the difference is in a range between about 1percent and about 4 percent. In an embodiment, the work-function layercontacts the intermixing layer. In an embodiment, the device furtherincludes a titanium nitride layer between the intermixing layer and thefilling-metal region. In an embodiment, the interfacial layer, thehigh-k dielectric layer, the intermixing layer, the work-function layer,and the filling-metal region form a gate stack of a transistor.

In accordance with some embodiments of the present disclosure, a devicecomprises a silicon germanium fin; a gate stack on the silicon germaniumfin, wherein the gate stack comprises: an interfacial layer contactingthe silicon germanium fin; a high-k dielectric layer over theinterfacial layer; an intermixing layer over and contacting the high-kdielectric layer, wherein the high-k dielectric layer has a firstdielectric constant, and the intermixing layer has a second dielectricconstant greater than the first dielectric constant; and a titaniumnitride layer over and contacting the intermixing layer; and asource/drain region on a side of the gate stack. In an embodiment, theintermixing layer comprises a metal different from metals in the high-kdielectric layer and layers in the gate stack and overlying theintermixing layer. In an embodiment, the intermixing layer comprisesoxygen and a metal selected from the group consisting of aluminum,titanium, hafnium, zirconium, and combinations thereof. In anembodiment, the silicon germanium fin comprises: a lower portion havinga first germanium atomic percentage; and an upper portion over andcontacting the lower portion, wherein the upper portion has a secondgermanium atomic percentage higher than the first germanium atomicpercentage. In an embodiment, at an interface between the lower portionand the upper portion, there is an abrupt increase from the firstgermanium atomic percentage to the second germanium atomic percentage.In an embodiment, the silicon germanium fin, the gate stack, and thesource/drain region are parts of a p-type transistor.

In accordance with some embodiments of the present disclosure, a methodcomprises forming an interfacial layer over a semiconductor region,wherein the interfacial layer comprises a semiconductor oxide;depositing a high-k dielectric layer over the interfacial layer;depositing a blocking layer over the high-k dielectric layer; depositinga metal layer over the blocking layer; performing an annealing processwhen the metal layer is over the blocking layer; and removing the metallayer. In an embodiment, an intermixing layer is formed between theblocking layer and the high-k dielectric layer by the annealing process.In an embodiment, the method further includes removing the blockinglayer; forming a work-function layer after the blocking layer isremoved; and forming a metal-containing capping layer over thework-function layer. In an embodiment, the method further includesforming a work-function layer over the blocking layer. In an embodiment,the depositing the metal layer comprises depositing a metal selectedfrom the group consisting of aluminum, titanium, hafnium, zirconium, andcombinations thereof. In an embodiment, the annealing process isperformed at a temperature in a range between about 400° C. and about535° C.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A method comprising: forming an interfacial layerover a semiconductor region, wherein the interfacial layer comprises asemiconductor oxide; depositing a high-k dielectric layer over theinterfacial layer; depositing a blocking layer over the high-kdielectric layer; depositing a metal layer over the blocking layer;performing an annealing process when the metal layer is over theblocking layer, wherein an intermixing layer is formed between theblocking layer and the high-k dielectric layer by the annealing process,and wherein the intermixing layer comprises a metal diffused from themetal layer; and removing the metal layer.
 2. The method of claim 1further comprising: removing the blocking layer to reveal theintermixing layer; forming a work-function layer over the intermixinglayer; and forming a metal-containing capping layer over thework-function layer.
 3. The method of claim 1 further comprising forminga work-function layer over the intermixing layer.
 4. The method of claim1, wherein the depositing the metal layer comprises depositing a metalselected from the group consisting of aluminum, titanium, hafnium,zirconium, chromium, tungsten, vanadium, molybdenum, and combinationsthereof.
 5. The method of claim 1, wherein the annealing process isperformed at a temperature in a range between about 400° C. and about535° C.
 6. The method of claim 1, wherein the intermixing layer furthercomprises oxygen deprived from the interfacial layer.
 7. A methodcomprising: forming an oxide layer over a semiconductor region;depositing a high-k dielectric layer over the oxide layer; depositing ablocking layer over the high-k dielectric layer; depositing a metallayer over the blocking layer; and performing an annealing process toform an intermixing layer between the high-k dielectric layer and themetal layer, wherein the intermixing layer comprises a metal oxide, witha metal in the metal oxide being diffused from the metal layer, andwherein an additional metal oxide layer is formed between the blockinglayer and the metal layer by the annealing process.
 8. The method ofclaim 7 further comprising, after the annealing process, removing themetal layer.
 9. The method of claim 7, wherein after the annealingprocess, the metal layer is substantially un-oxidized.
 10. The method ofclaim 7, wherein the annealing process is performed using a process gasselected from the group consisting of N₂, H₂, Ar, He, and combinationsthereof.
 11. The method of claim 7, wherein the depositing the metallayer comprises depositing an aluminum layer.
 12. The method of claim 7further comprising, depositing a work-function layer over theintermixing layer.
 13. The method of claim 12 further comprisingremoving the metal layer before the depositing the work-function layer.14. The method of claim 7, wherein the annealing process is performed ata temperature in a range between about 400° C. and about 535° C.
 15. Themethod of claim 7, wherein the additional metal oxide layer comprises anadditional metal oxide of a metal in the metal layer.
 16. A methodcomprising: forming an interfacial layer over a silicon germaniumregion, wherein the interfacial layer comprises a silicon oxide and agermanium oxide; depositing a high-k dielectric layer over theinterfacial layer; depositing a blocking layer over the high-kdielectric layer; depositing a metal layer over the blocking layer; andperforming an annealing process, wherein in the annealing process, thegermanium oxide in the interfacial layer is decomposed as geranium andoxygen, and the silicon oxide in the interfacial layer remains.
 17. Themethod of claim 16, wherein the oxygen generated from decomposedgermanium oxide diffuses to an interface region between the blockinglayer and the high-k dielectric layer to form an intermixing layer, andwherein the intermixing layer comprises oxygen, a first metal from theblocking layer, a second metal from the metal layer, and a third metalfrom the high-k dielectric layer.
 18. The method of claim 17 furthercomprising: removing the block layer to reveal the intermixing layer;and depositing a work-function layer over the intermixing layer.
 19. Themethod of claim 16, wherein the germanium generated from decomposedgermanium oxide diffuses into a surface layer of the silicon germaniumregion.
 20. The method of claim 16 further comprising, after theannealing process, removing the metal layer.